Board Type:Advanced Backplane Assembly

Model Number:259B2460BTG2

Material:High-grade aluminum alloy for superior thermal conductivity and durability

Dimensions:450mm x 100mm x 10mm

Weight:Approximately 1.5kg

Data Transmission Speed:Up to 10 Gbps

Power Consumption:Low power design for energy efficiency

Operating Temperature Range:-20°C to +70°C

Compliance Standards:UL, CE, FCC certified for global compatibility

Connector Compatibility:Supports various industry-standard connectors for seamless integration

    This Backplane Assembly Board from General Electric (GE) is meticulously engineered to provide unparalleled performance and durability in industrial control applications. Its robust aluminum alloy construction ensures longevity and resilience against harsh environmental conditions.

    Featuring industry-standard connectors, this board seamlessly integrates with GE’s Mark VI series of industrial control systems, enhancing system connectivity and data transfer capabilities. Its compact design optimizes space usage within complex control panels.

    The board operates efficiently within a wide temperature range (-20°C to +70°C), ensuring reliable performance across various industrial environments. With a moderate power consumption of 15W, it maintains energy efficiency without compromising on performance.

    Key to its functionality is the inclusion of high-quality materials and precision manufacturing processes, which contribute to enhanced reliability and reduced maintenance needs. This makes it an ideal choice for demanding industrial settings requiring high levels of operational uptime.

    Designed with ease of integration in mind, the GE 259B2460BTG2 Backplane Assembly Board supports streamlined installation and maintenance procedures, minimizing downtime and maximizing productivity in industrial operations.