Maximum Processing Temperature:Up to 350°C

Deposition Rate:Up to 50 Å/min

Etching Resolution:Sub-micron precision

Power Consumption:10 kW

Process Chamber Vacuum Level:1 x 10^-7 Torr

Vacuum Pump Capacity:200 l/s

    The Applied Materials GMSV36-01-D 91/096D/E is engineered to deliver unparalleled performance in semiconductor manufacturing environments. This cutting-edge module is specifically tailored for etching and deposition applications, ensuring exceptional precision and yield in semiconductor fabrication processes.

    Featuring an operating temperature range of -40°C to 85°C, it ensures reliability across a wide spectrum of environmental conditions, making it suitable for various industrial settings. With a power consumption of 1500W, it efficiently manages energy use, contributing to cost-effectiveness and sustainability.

    Equipped with a robust water-cooled system and automated temperature control, this module maintains optimal process conditions, minimizing thermal fluctuations and enhancing product quality. The ability to operate at up to 30 wafers per hour sets it apart, offering significant throughput without compromising on the quality of the semiconductor products.

    Versatile in its material compatibility, the GMSV36-01-D 91/096D/E can handle a variety of substrates including silicon, germanium, and III-V compounds, catering to diverse semiconductor needs. This flexibility ensures that manufacturers can adapt to different materials and production requirements.

    In summary, the Applied Materials GMSV36-01-D 91/096D/E is a state-of-the-art solution for semiconductor processing, combining precision, efficiency, and adaptability to meet the demands of modern semiconductor fabrication.